PACKAGE STRUCTURE

专利名称：PACKAGE STRUCTURE发明人：Chen-Heng Liu,Yung-Fu Chang申请号：US15853979申请日：20171226

公开号：US20180240736A1公开日：20180823

专利附图：

摘要：Provided is a package structure including a substrate, a metal pad, a firstpolymer layer, a second polymer layer, a redistribution layer (RDL), and a third polymerlayer. The metal pad is located on the substrate. The first polymer layer is located on thesubstrate. The first polymer layer has a first opening which exposes a portion of a top

surface of the metal pad. The second polymer layer is located on the first polymer layer.The second polymer layer has a second opening which exposes the portion of the topsurface of the metal pad and a first top surface of the first polymer layer. The RDL coversthe portion of the top surface of the metal pad and extends onto a portion of the firsttop surface of the first polymer layer and the second polymer layer. The third polymerlayer is located on the RDL.

申请人：Winbond Electronics Corp.

地址：Taichung City TW

国籍：TW

更多信息请下载全文后查看